Engineering Excellence for the Semiconductor Revolution
From AI accelerators to quantum processors, TeamUP provides the specialized engineering talent driving next-generation chip innovation
The semiconductor industry is experiencing unprecedented demand across every application area. Whether you're developing cutting-edge AI chips for data centers, automotive semiconductors for electric vehicles, or quantum computing processors, TeamUP connects you with elite engineers who understand the complexities of advanced node design and emerging technologies.
- $1T Semiconductor market by 2030
- 33% Industry growth projected
- 3,000+ Specialized engineers
- 3nm Advanced node expertise
Powering Innovation Across Every Semiconductor Application
Data Centers & AI
- ASIC/RTL Design
- Physical Design (Advanced Packaging)
- Thermal Management
- Memory Interface Specialists
Key Focus: HBM integration, AI accelerators, COWOS packaging
Mobile & Consumer
- SoC Architects
- Low-Power Design
- RF/Wireless Engineers
- Package Design
Key Focus: 5G modems, image processors, battery optimization
Industrial IoT
- MCU Design Engineers
- Sensor Specialists
- Security Engineers
- Edge AI Experts
Key Focus: Low-power MCUs, MEMS sensors, secure connectivity
Communications
- CPU/GPU Architects
- Interconnect Engineers
- Cache Design
- Thermal Engineers
Key Focus: 5G/6G, 400G/800G interfaces, mmWave circuits
Quantum Computing
- Quantum Device Engineers
- Cryogenic Electronics
- Control Systems
- Error Correction Specialists
Key Focus: Qubit control, ultra-low temperature operation, quantum-classical integration
Automotive
- Power Semiconductor Engineers
- Functional Safety Experts
- Analog/Mixed-Signal
- EMC/EMI Specialists
Key Focus: SiC/GaN devices, ISO 26262 compliance, ADAS systems
Industrial IoT
- MCU Design Engineers
- Sensor Specialists
- Security Engineers
- Edge AI Experts
Key Focus: Low-power MCUs, MEMS sensors, secure connectivity
Comprehensive Coverage Across All Semiconductor Categories
Memory Chips
Types We Support:
- HBM - High-bandwidth memory for AI
- DRAM - Advanced DDR5/DDR6 development
- SRAM - Cache and embedded memory
- Flash - NAND/NOR for storage
- Emerging Memory - MRAM, ReRAM, PCM
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Engineering Expertise:
- Memory architecture design
- High-speed interface development
- Error correction implementation
- Power optimization
- Advanced packaging integration
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Logic Chips
Types We Support:
- CPUs - x86, ARM, RISC-V architectures
- GPUs - Graphics and AI acceleration
- AI Accelerators - AI Accelerators
- FPGAs - Reconfigurable computing
- Microcontrollers - Embedded processing
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Engineering Expertise:
- RTL design and verification
- Physical implementation (7nm to 3nm)
- Clock and power distribution
- Design for testability
- Performance optimization
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Analog & Mixed-Signal
Types We Support:
- Power Management ICs - Voltage regulators, PMICs
- Data Converters - High-speed ADCs/DACs
- RF Transceivers - 5G/6G, WiFi, Bluetooth
- Sensor Interfaces - Precision analog front-ends
- Audio/Video - Codecs and processors
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Engineering Expertise:
- Analog circuit design
- Mixed-signal verification
- Layout optimization
- Noise and interference mitigation
- Process migration
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Power Semiconductors
Types We Support:
- Silicon Carbide (SiC) - High-voltage, high-temp
- Gallium Nitride (GaN) - Fast switching
- Power MOSFETs - Efficient power control
- IGBTs - High-power applications
- Power Modules - Integrated solutions
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Engineering Expertise:
- Wide bandgap design
- Thermal management
- Gate driver design
- Reliability engineering
- Package development
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SEMICONDUCTOR & HARDWARE ENGINEERING
| Engineering Discipline | Capabilities | Tools & Technologies | Specialization Details | Availability |
|---|---|---|---|---|
| ASIC/RTL Design |
•Architecture definition •Microarchitecture •RTL coding •IP integration •Clock domain crossing •Low power design |
• SystemVerilog • Verilog • VHDL • Synopsys DC • Cadence Genus • Design Compiler |
• Digital design for SoC, CPU, GPU • Bus protocols (AXI, AHB, PCIe) • Memory controllers • High-speed interfaces • Power management units |
500+ Engineers |
| FPGA Design |
•RTL development •IP core integration •Timing optimization •Resource utilization •Prototyping |
• Xilinx: Vivado 2019-2024 • Intel/Altera: Quartus Prime • Microsemi: Libero SoC • Languages: VHDL, Verilog, SystemVerilog • Simulation: ModelSim, VCS |
• FPGA Families: Virtex, Kintex, Zynq, Arria, Stratix • Applications: Telecom, Defense, HPC • Firmware development • Model simulation & verification • HLS (High-Level Synthesis) |
400+ Engineers |
| Design Verification |
• Test plan creation •Testbench architecture •Coverage analysis •Scoreboard development •Assertion-based verification |
• Methodologies: UVM, OVM, VMM • Languages: SystemVerilog, C++,Python • Tools: VCS, Questa, Xcelium • Formal: JasperGold, VC Formal |
• Verification Types: SoC, Core, IP, Subsystem • Chip Types:: Digital, Mixed-signal, RF • Functional/Performance verification • Gate-level simulation • HLS (High-Level Synthesis) |
600+ Engineers |
| DFT Engineering |
• Test architecture • Scan insertion •ATPG pattern generation •Fault analysis •Debug & diagnostics |
• ATPG: TetraMAX, Tessent • BIST: MBIST, LBIST tools • Scan: Scan compression • Analysis: Z01X, ET tools |
• Test Types: Stuck-at, Transition, Path delay • Memory BIST implementation • Boundary scan (JTAG) • Hierarchical DFT •ATE interface development |
200+ Engineers |
| Physical Design |
• Floorplanning • Place & Route •CTS (Clock Tree Synthesis) •Timing closure •Power optimization •Physical verification |
• P&R: Innovus, ICC2, Fusion Compiler • Timing: PrimeTime, Tempus • Power: RedHawk, Voltus • Extraction: StarRC, Quantus |
• Nodes: 45nm → 2nm • FinFET: 16nm and below • Multi-Vt optimization • Multi-corner/mode analysis •ECO implementation |
400+ Engineers |
| Engineering Discipline | Capabilities | Tools & Technologies | Specialization Details | Availability |
|---|---|---|---|---|
| Analog Layout Design |
•Custom layout •Matching techniques •Parasitic optimization •DRC/LVS clean •EM/IR analysis |
• Layout: Cadence Virtuoso • Verification: Calibre, Assura • Extraction:QRC, StarRC • EM/IR:Totem, Voltus |
• Circuits PLL, VCO, LDO, Bandgap, ADC/DAC • Nodes180nm → 3nm • Device matching & shielding • High-speed layout techniques • RF layout considerations |
250+ Engineers |
| Digital Layout Design |
•Standard cell placement •Memory compiler use •Power grid design •Signal routing •Timing optimization |
• Tools: Innovus, ICC2 • Memory: Artisan, Faraday • Verification: Calibre • Analysis: PrimeTime |
• Memory Types: SRAM, DDR4/5, HBM, Flash • SRAM, DDR4/5, HBM, Flash: 45nm → 5nm • Custom digital blocks • High-density placement • Multi-bit optimization |
200+ Engineers |
| Engineering Discipline | Capabilities | Tools & Technologies | Specialization Details | Availability |
|---|---|---|---|---|
| Systems Engineering |
•Requirements management •Architecture design •Interface definition •Trade studies •Trade studies •V&V planning |
•Modeling: SysML, MATLAB •Requirements: DOORS, Jama •Simulation: Simulink Analysis: ModelSim |
• Complex system integration • Hardware/Software partitioning • Performance modeling • Risk assessment • Compliance (DO-254, ISO 26262) |
300+ Engineers |
| Mechanical Engineering |
•Thermal design •Structural analysis •Package design •Enclosure development •CFD analysis |
• CAD: SolidWorks, CATIA, Creo • Thermal: Ansys Icepak, FloTHERM • FEA: ANSYS, COMSOL • CFD:Fluent, CFX |
• Heat sink design • Liquid cooling systems • Vibration analysis • EMI/RFI shielding • Design for manufacturing |
350+ Engineers |
| Engineering Discipline | Capabilities | Tools & Technologies | Specialization Details | Availability |
|---|---|---|---|---|
| Embedded Software |
•RTOS development •Device drivers •BSP development •Hardware abstraction •Real-time systems |
Languages: C, C++, Assembly RTOS:FreeRTOS, VxWorks, QNX Tools: IAR, Keil, GCC Debug: JTAG, Trace32 |
• Microcontroller programming • Interrupt handling • Memory management • Power optimization • Safety-critical systems |
450+ Engineers |
| Software Development |
•Application development •API design •System software •Performance optimization •Testing frameworks |
Languages: C++, Python, Java, Go Frameworks:Qt, Boost Tools: Git, Jenkins, Docker Testing: GTest, PyTest |
• Linux/Windows applications • Multi-threaded programming • Network protocols • Database integration • Cloud deployment |
800+ Engineers> |
| Firmware Engineering |
•Bootloader development •Hardware initialization •Protocol stacks •Diagnostic routines •Update mechanisms |
Languages: C, Assembly Protocols:I2C, SPI, UART, PCIe Tools: Logic analyzers Flash: NOR, NAND programming |
• UEFI/BIOS developmen • Secure boot implementation • Hardware diagnostics • Field update systems • Low-level debugging |
300+ Engineers |
| Engineering Discipline | Capabilities | Tools & Technologies | Specialization Details | Availability |
|---|---|---|---|---|
| RF/Microwave |
• mmWave design •Antenna design • Power amplifiers •LNA design •Filter design |
Simulation: ADS, HFSS, CST Layout:Cadence RF Measurement: VNA, Spectrum analyzers |
• 5G/6G applications • Radar systems • Satellite communications • IoT wireless • Beamforming arrays |
250+ Engineers |
| Memory Design |
•SRAM/DRAM arrays •Sense amplifiers •Decoders •Redundancy •BIST integration> |
• Memory compilers • SPICE simulators • Repair analysis tools • Yield optimization |
• High-speed memory • Low-power memory • Embedded memory • Memory controllers • Error correction |
150+ Engineers |
| Power Management |
• DC-DC converters • LDO design • Battery management • Power distribution • Energy harvesting |
Design: Cadence, LTspice Simulation:PLECS, PSIM Layout: Altium, Allegro Thermal: ANSYS |
• Multi-phase controllers • Digital power control • GaN/SiC applications • Wireless charging • USB-PD implementation |
200+ Engineers |
Proven Results for Industry Leader
AI Chip Breakthrough
Client: Leading Cloud Provider Challenge: Develop custom AI training chip with HBM3 integration Solution:
- Deployed 8-person team: RTL, physical design, DFT
- Implemented advanced COWOS packaging
- Achieved 40% better performance than target
Results:
- First silicon success at 5nm
- 6-month acceleration of roadmap
- 95% chip utilization achieved
Automotive Safety Innovation
Client: Tier-1 Automotive Supplier Challenge: Design ISO 26262 ASIL-D compliant ADAS processor Solution:
- Provided functional safety experts
- Implemented redundant architectures
- Developed comprehensive safety documentation
Results:
- Achieved ASIL-D certification
- 30% reduction in verification time
- Zero safety-critical bugs in production
5G Infrastructure Scale-Up
Client: Communications Equipment Leader Challenge: Rapidly scale RF engineering team for 5G rollout Solution:
- Deployed 5 RF/analog engineers
- Covered mmWave and sub-6GHz designs
- Provided layout and verification support
Results:
- 3x increase in design throughput
- 30% improvement in power efficiency
- On-time delivery of complete product line
Ready to Accelerate Your Semiconductor Innovation?
Join industry leaders who trust TeamUP for their most critical semiconductor engineering needs. From concept to silicon, our engineers deliver excellence at every stage.
Immediate Access Pre-vetted engineers ready to start within days
Flexible Engagement Scale up or down based on project needs
Proven Expertise Deep experience across all nodes and technologies
Quick Contact: Prefer to talk? Call our semiconductor staffing experts: 512-535-7779 | semiconductor@teamuptech.com