
Engineering Excellence for the Semiconductor Revolution
From AI accelerators to quantum processors, TeamUP provides the specialized engineering talent driving next-generation chip innovation
The semiconductor industry is experiencing unprecedented demand across every application area. Whether you're developing cutting-edge AI chips for data centers, automotive semiconductors for electric vehicles, or quantum computing processors, TeamUP connects you with elite engineers who understand the complexities of advanced node design and emerging technologies.
- $1T Semiconductor market by 2030
- 33% Industry growth projected
- 3,000+ Specialized engineers
- 3nm Advanced node expertise
- Power Semiconductor Engineers
- Functional Safety Experts
- Analog/Mixed-Signal
- EMC/EMI Specialists
- SoC Architects
- Low-Power Design
- RF/Wireless Engineers
- Package Design
Key Focus: 5G modems, image processors, battery optimization
- MCU Design Engineers
- Sensor Specialists
- Security Engineers
- Edge AI Experts
Key Focus: Low-power MCUs, MEMS sensors, secure connectivity
- CPU/GPU Architects
- Interconnect Engineers
- Cache Design
- Thermal Engineers
Key Focus: 5G/6G, 400G/800G interfaces, mmWave circuits
- Quantum Device Engineers
- Cryogenic Electronics
- Control Systems
- Error Correction Specialists
Key Focus: Qubit control, ultra-low temperature operation, quantum-classical integration
- Power Semiconductor Engineers
- Functional Safety Experts
- Analog/Mixed-Signal
- EMC/EMI Specialists
Key Focus: SiC/GaN devices, ISO 26262 compliance, ADAS systems
- MCU Design Engineers
- Sensor Specialists
- Security Engineers
- Edge AI Experts
Key Focus: Low-power MCUs, MEMS sensors, secure connectivity

Types We Support:
- HBM - High-bandwidth memory for AI
- DRAM - Advanced DDR5/DDR6 development
- SRAM - Cache and embedded memory
- Flash - NAND/NOR for storage
- Emerging Memory - MRAM, ReRAM, PCM
Engineering Expertise:
- Memory architecture design
- High-speed interface development
- Error correction implementation
- Power optimization
- Advanced packaging integration
Types We Support:
- CPUs - x86, ARM, RISC-V architectures
- GPUs - Graphics and AI acceleration
- AI Accelerators - AI Accelerators
- FPGAs - Reconfigurable computing
- Microcontrollers - Embedded processing
Engineering Expertise:
- RTL design and verification
- Physical implementation (7nm to 3nm)
- Clock and power distribution
- Design for testability
- Performance optimization
Types We Support:
- Power Management ICs - Voltage regulators, PMICs
- Data Converters - High-speed ADCs/DACs
- RF Transceivers - 5G/6G, WiFi, Bluetooth
- Sensor Interfaces - Precision analog front-ends
- Audio/Video - Codecs and processors
Engineering Expertise:
- Analog circuit design
- Mixed-signal verification
- Layout optimization
- Noise and interference mitigation
- Process migration
Types We Support:
- Silicon Carbide (SiC) - High-voltage, high-temp
- Gallium Nitride (GaN) - Fast switching
- Power MOSFETs - Efficient power control
- IGBTs - High-power applications
- Power Modules - Integrated solutions
Engineering Expertise:
- Wide bandgap design
- Thermal management
- Gate driver design
- Reliability engineering
- Package development
Client: Leading Cloud Provider Challenge: Develop custom AI training chip with HBM3 integration Solution:
- Deployed 8-person team: RTL, physical design, DFT
- Implemented advanced COWOS packaging
- Achieved 40% better performance than target
Results:
- First silicon success at 5nm
- 6-month acceleration of roadmap
- 95% chip utilization achieved
Client: Tier-1 Automotive Supplier Challenge: Design ISO 26262 ASIL-D compliant ADAS processor Solution:
- Provided functional safety experts
- Implemented redundant architectures
- Developed comprehensive safety documentation
Results:
- Achieved ASIL-D certification
- 30% reduction in verification time
- Zero safety-critical bugs in production
Client: Communications Equipment Leader Challenge: Rapidly scale RF engineering team for 5G rollout Solution:
- Deployed 5 RF/analog engineers
- Covered mmWave and sub-6GHz designs
- Provided layout and verification support
Results:
- 3x increase in design throughput
- 30% improvement in power efficiency
- On-time delivery of complete product line

Immediate Access Pre-vetted engineers ready to start within days
Immediate Access Pre-vetted engineers ready to start within days
Immediate Access Pre-vetted engineers ready to start within days
Quick Contact: Prefer to talk? Call our semiconductor staffing experts: 512-535-7779 | semiconductor@teamup.com